发明名称 |
Method and apparatus for soldering and soldering land of a printed circuit board |
摘要 |
A pair of soldering irons are fixed to a sliding plate at a predetermined interval. The soldering irons are integrally moved so as to reciprocate in a rectangular direction relative to a conveyor belt. One of the soldering irons is conveyed to a working position of the conveyor belt and the other of them is separated from the conveyor belt. While one of the soldering irons solders a circuit board, the other is cleaned. The circuit board has a slit into which a metal plate is inserted and soldered. For the slit, a soldering land constituted of a main-land and a sub-land is provided. The main-land is formed along one of longer sides of the slit. The sub-land is elongated from the main-land along a shorter side of the slit. The soldering land is not formed all around the slit so that the slit is not closed by solder when the circuit board is dip-soldered.
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申请公布号 |
US6471109(B2) |
申请公布日期 |
2002.10.29 |
申请号 |
US20010912311 |
申请日期 |
2001.07.26 |
申请人 |
FUJI PHOTO FILM CO., LTD. |
发明人 |
MURAMATSU MASAYOSHI;WATANABE KENICHI |
分类号 |
B23K1/00;H05K1/11;H05K3/34;(IPC1-7):B23K37/02 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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