| 摘要 |
A chip slapper including a substrate, a sticking layer on the substrate, a conductive layer on the sticking layer in the shape of two lands separated by a bridge portion between the two lands, a buffer material on the conductive layer, a protective coating on the buffer layer extending across at least a substantial portion of the two lands but absent from the bridge portion, and a flyer layer over the bridge portion. The buffer layer prevents migration of the material of the coating into the material of the conductive layer and vice versa and better adheres the flyer layer on the bridge portion where the coating is absent.
|
