发明名称 METHOD AND DEVICE FOR MATCHING SUBSTRATES
摘要 PURPOSE: A method and device for matching substrates are provided to accurately and reliably match two substrate in a short time, even for a large substrate. CONSTITUTION: When two substrates(33,34) are matched together with mechanical pressurizing force in a vacuum chamber, pressurization mechanisms(16) which pressurize the vicinities of four corner parts of the square substrates are respectively provided, the gap between the substrates is observed after pressurizing the vicinities with the predetermined pressurizing force, and the vicinities are pressurized after adjusting the pressurizing force of each pressurization mechanism based on the observation.
申请公布号 KR20020081543(A) 申请公布日期 2002.10.28
申请号 KR20020010530 申请日期 2002.02.27
申请人 HITACHI INDUSTRIES CO., LTD. 发明人 HIRAI AKIRA;IMAIZUMI KIYOSHI;MURAYAMA TAKAO;NAKAYAMA YUKINORI;SAITO MASAYUKI;YAWATA SATOSHI
分类号 G02F1/13;G02F1/1339;G09F9/30;(IPC1-7):G02F1/13 主分类号 G02F1/13
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