| 摘要 |
PURPOSE: A method of fabricating an injection material for shielding an EMI(Electro-Magnetic Interference) is provided to reduce a fabricating cost by performing an adhering process of conductive powders together with an injecting process in a fabrication process of the injection material. CONSTITUTION: A control portion performs a control operation to open a moving portion of a mold(S1). The control portion performs a control operation to apply the high voltage to the moving portion of the mold corresponding to a surface of an injection material by controlling a high voltage supply portion(S2). The control portion performs a control operation to inject conductive powders to the moving portion of the mold by controlling an injector(S3). The control portion performs a control operation to move the moving portion to a fixing portion and shield the high voltage applied to the moving portion(S4). The control portion performs a control operation to open the moving portion of the mold and separate the injection material from the mold after an injecting process is finished(S5).
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