| 摘要 |
A three-dimensional, stacked semiconductor device assembly with microelectronic spring contacts, and components thereof, is disclosed. The assembly comprises a plurality of stacked modules, which are capable of being readily mounted to, and demounted from, one another. Each module of the assembly comprises a semiconductor device, comprising a die, mounted to an stacking substrate. The die and the stacking substrate are optionally capable of being readily mounted to, and demounted from one another. A bottommost module in the assembly is suitable for attaching directly to a substrate or other component, such as a printed circuit board, and a topmost component in the assembly preferably comprises a decoupling and/or termination substrate. Each semiconductor device in the assembly has terminals on a surface thereof, at least selected ones of which are provided with an contact element. In addition, each device preferably comprises one or more stop structures for the microelectronic springs on its terminal surface. Contact elements on the semiconductor device and between adjacent modules preferably comprise microelectronic lithographic-type molded spring contacts. Each stacking substrate additionally includes a conductive trace between individual ones of the contact elements. The stacking substrate optionally includes separate ground planes and/or power planes for controlled impedance signal traces. The assembly optionally includes a heat spreader disposed between individual ones of each module, preferably in contact with a non-terminal side of each semiconductor device, which serves as a heat sink and heat exchanger for waste heat generated by the device during operation. |
