| 摘要 |
PROBLEM TO BE SOLVED: To suppress the total thickness of a semiconductor device containing semiconductor elements mounted on a substrate to a small thickness. SOLUTION: The semiconductor device is provided with the semiconductor elements 8a and 8b having electrodes, the substrate 4 having a housing section which is opened on at least one side and in which the elements 8a and 8b are housed, and films 1a and 1b having conductive sections 2 arranged at positions corresponding to the electrodes on their surfaces. The elements 8a and 8b are housed in the housing section and the films 1a and 1b are arranged on at least one side of the substrate 4 so that the conductive sections 2 are faced to the substrate 4. The electrodes are electrically connected to their corresponding conductive sections 2. |
