| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning device capable of effectively cleaning a mold for a semiconductor resin sealing apparatus. SOLUTION: The cleaning device 30 for the mold of a semiconductor resin sealing apparatus comprises a cleaning head 3 having at least one flat surface. The head 3 has rolling brushes 9a, 9b which rotate with a rotary shaft parallel to at least one flat surface as a center and are provided on the flat surface, suction ports 8a, 8b provided on the surface of a rotating direction of the brushes, and ducts 6a, 6b, 7 for sending dusts collected from the suction ports to an outlet through the interior of the head. The suction ports include parts in which sectional areas are increased from the surface toward the interior of the head. |
