| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipating material which has little warpage after being bonded with a semiconductor insulating substrate and is more compact, by providing fins having satisfactory ebullient efficiency for cooling liquid on a heat dissipating layer side of the heat dissipating material and by making a heat receiving layer side have a lower thermal expansion coefficient, and to provide a method for manufacturing it at a low cost. SOLUTION: A heat dissipating material 1 is made of a porous sintered body obtained by adding a binder to a mixed material of metal powder having high thermal conductivity and inorganic material powder having a thermal expansion coefficient lower than that of the metal powder. The heat dissipating material is provided with a heat receiving layer 2 for receiving the heat from a heat generating body and a heat dissipating layer 3 integrated with the layer 2 to dissipate the heat from the layer 2 toward the outside, and fins 4 having high porosity are provided on the layer 3 with spaced. Inter-fin grooves 11 are formed into the shapes of recessed arcs and constituted so as to have low porosity. The layer 2 is made of a composite material having a low thermal expansion coefficient, and the heat generating body is bonded thereon via a metal 47 for bonding an insulating material.
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