| 摘要 |
PROBLEM TO BE SOLVED: To prevent peeling of a soldered part in a soldered structure in which a terminal member made of a metal plate is soldered to a terminal electrode located on the main body, which is constituted by a ceramic, of an electronic component due to bending of the terminal member by a temperature variation, in case the terminal member is constituted by a two-layer structure consisting of a first layer having a relatively small thermal expansion coefficient and a second layer having a relatively low electrical resistivity to bring the thermal expansion coefficient of the terminal member close to that of the ceramic while preventing increase of the electrical resistivity of the terminal member. SOLUTION: For the metal plate that constitutes the terminal member 29, at least a three-layer structure is used, which contains first and second outer layers 32, 33 having electrical resistivities of 10μΩ.cm or lower and an inner layer 34 positioned between the first and second outer layers 32, 33 and having a thermal expansion coefficient of 1.0×10<-5> / deg.C or lower, which is smaller than those of the first and the seciond external layers.
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