| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface-mounting type electronic circuit unit that is suitable for miniaturization, can be manufactured easily, and is provided with a shielding cover. SOLUTION: Circuit element 3, such as a resistor, capacitor, etc., and a conductive pattern composed of a thin film are formed on a square plate-shaped substrate 1 made of an alumina material and, at the same time, a grounding pattern 5 is formed by wire-bonding a semiconductor bare chip 4, such as a transistor, diode, etc., and exposing part of the conductive pattern on the edge section of the substrate 1. After an insulation adhesive 6 is potted on an area of the substrate 1 except for the grounding pattern 5 and a conductive adhesive 7 is applied to the pattern 5, the shielding cover 2 is attached to the substrate 1 by utilizing the adhesive forces of the adhesives 6 and 7 and electrically connected to the grounding pattern 5 via the adhesive 7 by curing the adhesives 6 and 7 under almost the same curing condition. |
