| 摘要 |
PROBLEM TO BE SOLVED: To propose a method of manufacturing a light receiving and emitting device for optical head capable of positioning laser diode chips with high accuracy while making a laser emission point higher than the surface of a photodetector so that shading of laser beams can be prevented on the photodetector. SOLUTION: In this method of manufacturing light receiving the emitting device 4 of an optical head 1, a sub mounting substrate 42 is pasted onto a photodetector substrate 41 where the photodetector 45 is built in a wafer process, and the first and second laser diode chips 43 and 44 are subsequently mounted on the sub mounting substrate 42. A positioning member 48 for positioning the chips 43 and 44 is formed with an alignment mark 410a of a semiconductor substrate wafer in which the photodetector is built in the wafer process as reference. Accordingly, the positional accuracy of the laser diode chips and the photodetector can be improved. |
