| 摘要 |
PROBLEM TO BE SOLVED: To provide a sucking probe whereby a semiconductor chip can be carried while keeping clean the element surface of the chip when subjecting the chip to a flip-chip mounting. SOLUTION: The sucking probe 2 has a hollow structure equipped with a sucking hole 3, and has such a structure that, by evacuating the inside of the sucking hole 3 with a vacuum pump, it sucks with its sucking surfaces 2a, 2b the two side surfaces of a semiconductor chip 1 which have a corner point of the chip 1 in common. The sucking hole 3 is communicated with the sucking portions 2a, 2b, and is branched off in two directions on its way and reaches the sucking surfaces 2a, 2b. By operating the sucking probe 2 in such a way that the inside pressure of the sucking hole 3 is reduced only when the semiconductor chip 1 is to be sucked, it realizes the sucking/releasing operations of the semiconductor chip 1. |
