发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE
摘要 PROBLEM TO BE SOLVED: To economically manufacture a plurality of kinds of light emitting devices having their respective substrates having different predetermined dimensions from a single substrate mother material having a plurality of LED chips, etc., without needing to manufacture a substrate mother material every substrate different in dimensions. SOLUTION: The method comprises manufacturing a substrate mother material 10 having a plurality of LED chips 16 and a clad 34 and cutting the substrate mother material along longitudinal and transverse cutting lines A, B for forming four kinds of substrates having different predetermined dimensions (width and depth), i.e., along longitudinal cutting lines A9, A14, A18, A19 and transverse cutting lines B3, B4, B7, B10 resulting in that each substrates has the LED chip 16 and the clad 34. Thus first to fourth light emitting devices having their respective substrates having different dimensions (width and depth) can be formed.
申请公布号 JP2002314147(A) 申请公布日期 2002.10.25
申请号 JP20010113492 申请日期 2001.04.12
申请人 ROHM CO LTD 发明人 OKAZAKI TADAHIRO
分类号 H01L23/12;H01L33/56;H01L33/62 主分类号 H01L23/12
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