| 摘要 |
PROBLEM TO BE SOLVED: To prevent a bump from being out of alignment with a board electrode at a bonding portion because of a positioning accuracy in the forming of the bump, a positioning accuracy in mounting, the shape of the board electrode, and the parallelism of a pressure bonding tool when the bump is pressure bonded to the board electrode by the use of the pressure bonding tool. SOLUTION: This board has a circuit board 11 having the board electrode 8 formed thereon, an intermediate member 13 arranged on the circuit board 11 so as to form an opening portion 15 corresponding to the board electrode 8 formed on the circuit board 11, a resin sheet 6 arranged on the intermediate member 13, and a semiconductor device 1 having a bump 3 passing through the resin sheet 6 and bonded to the board electrode 8 through the opening portion 15. |
