SEMICONDUCTOR WAFER GRASPING DEVICE

摘要

PROBLEM TO BE SOLVED: To guarantee secure grasping of a semiconductor wafer even when a rotor rotates at high speed in a semiconductor wafer grasping device. SOLUTION: In the semiconductor wafer grasping device, the semiconductor wafer 4 is grasped by a grasping pawl 2 which is arranged on the circumference of a rotor 1 and is fitted to rock in the radial direction. A steel ball 3 is brought into contact with parts below the axes of the respective grasping pawls 2. The grasping pawls 2 are inclined around the axes by centrifugal force operated on the steel ball 3 when the rotor 1 rotates, and grasping force on the semiconductor wafer 4 is strengthened.