发明名称 SEMICONDUCTOR MANUFACTURING EQUIPMENT
摘要 <p>PROBLEM TO BE SOLVED: To provide semiconductor manufacturing equipment of high reliability wherein improvement of life of quartz is achieved while the number of particles is reduced. SOLUTION: A semiconductor manufacturing equipment main body 100 is provided with a tube 101 (outer tube 101a, inner tube 101b) which is installed in a CVD furnace or the like. A boat base 104 introduces a boat 105 which is formed of quartz and on which a plurality of wafers WF are mounted to the inside and the outside of the inner tube 101b (load/unload). Surfaces of the tube 101 (101a, 101b) and the boat 105 are previously coated with buffer films 106 in which difference of coefficients of thermal expansion to deposits generated in film forming treatment of a wafer is small as compared with that of quartz.</p>
申请公布号 JP2002313740(A) 申请公布日期 2002.10.25
申请号 JP20010118762 申请日期 2001.04.17
申请人 SEIKO EPSON CORP 发明人 OSAWA TOSHIHIKO
分类号 C23C16/44;H01L21/205;H01L21/68;H01L21/683;(IPC1-7):H01L21/205 主分类号 C23C16/44
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