| 摘要 |
PROBLEM TO BE SOLVED: To solder a problem that, in a solder to be used when a printed wiring board is soldered by use of a jet type soldering device, the solder is of a type of JIS Standards H63 (S, A, B) composed of lead of 37 wt.% and tin of the residue, and then this solder generates an oxide having an extremely strong adhesive force, and if this has been once adhered, it is hard to separate it, so that a jet wave of a fused solder is disturbed and it was difficult to stably solder the printed wiring board of a thickness about 0.6 mm to 0.8 mm for a long period. SOLUTION: A fused solder 1 which contains zinc of 3 to 12 wt.% and substantially tin of the residue is used and a flow of the fused solder 1 is rectified by a rectifying means to then form a jet wave. Soldering of a printed wiring board of a sheet thickness of about 0.6 mm to 0.8 mm is repeatedly continuously carried out. |
