发明名称 THICK FILM RESISTIVE PLATE
摘要 <p>PROBLEM TO BE SOLVED: To provide a thick film resistive plate which is reduced in resistance by means of providing a gap between conductor patterns on which a resistive material is printed, reducing the resistive material in area so as not to be printed in the gap, and increasing the resistive material in thickness. SOLUTION: A thick film resistive plate 10 is composed of a conductor pattern 20 which includes a plurality of separate stationary electrodes 21 printed on an insulating board 11, and formed into a parallel circuit 22 and resistors 30 which are printed on the stationary electrodes 21 respectively to connect them in a widthwise direction. An opening 24 is provided at the center of the stationary electrode 21 where the resistor 30 is printed so as to form a narrow part 23 (in other words, a forked part) on each side of the electrode 21. A blank part 31 where no resistor is printed is provided to the resistor 30 corresponding to the opening 24, so that the resistor 30 is reduced in area but increased in film thickness.</p>
申请公布号 JP2002313603(A) 申请公布日期 2002.10.25
申请号 JP20010118209 申请日期 2001.04.17
申请人 YAZAKI CORP 发明人 NAGAKURA SHUNSUKE;OISHI MANABU;MARUO HISAFUMI
分类号 G01F23/36;H01C1/14;H01C7/00;(IPC1-7):H01C7/00 主分类号 G01F23/36
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