METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a means improving the bending strength of an IC so as to prevent chip cracking due to local card bending. SOLUTION: In a method for manufacturing a semiconductor device, in the biaxial process of grinding a semiconductor wafer, a material whose grain size is finer than before is used for a grindstone to be used for grinding and the revolution of the grindstone is increased (6000 r.p.m) preferably.