发明名称 ELECTRONIC DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To reduce a substantially mounting area of a plurality of electronic components by mounting the plurality of the components on one mounting board, and to improve stability of a strength of a mechanical connection of the connecting electrode of an electronic component with a conductor pattern of a mounting board, and its connection without affecting an influence to the operation of the component in a simple step with a simple constitution. SOLUTION: An electronic device 10 comprises the mounting substrate 11 having a conductor pattern 12 exposed with one surface 11a, the plurality of electronic components 13 having connecting electrodes 14 on a surface 13a, disposing the surface 13a having the electrodes 14 oppositely to the one surface 11a of the board 11, electronically and mechanically connecting the electrodes 14 to the pattern 12 of the board 11, and a resin film 15 covering the plurality of the components 13 and the board 11, so as to closely contact with the opposite side surface 13b to the board 11 of the plurality of the components 13 and to be adhered to the board 11.
申请公布号 JP2002313828(A) 申请公布日期 2002.10.25
申请号 JP20010118662 申请日期 2001.04.17
申请人 TDK CORP 发明人 MORIYA BUNJI;NAKAI SHINYA;HAYASHI SHINICHIRO;TAJIMA MORIKAZU;KUROSAWA FUMIKATSU
分类号 H05K1/18;H01L21/56;H01L25/04;H01L25/18;H03H9/25;(IPC1-7):H01L21/56 主分类号 H05K1/18
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