| 摘要 |
PROBLEM TO BE SOLVED: To automate the detection of the projection caused by the deformation of a bump electrode. SOLUTION: In a semiconductor device manufacturing method which inspects a semiconductor device where a plurality of bump electrodes are made in planar forms on the mounting face of the semiconductor device, a plurality of edges of the bump electrode are detected from the plane image of the mounting face. Based on the detected edge, the center of a ball and the radius of a ball circle are obtained, an inspection circle centering upon the center of the ball is set with a radius where a set value is added to the radius of the ball, and the detection of the edge of the bump electrode is performed along the circumference of this inspection circle, thereby detecting the deformation of the bump electrode. Likewise, the inner margin of the inspection range in the shape of a circle centering upon the center of the ball is set with the radius where the set value is added to the radius of the ball, and an outer margin of the inspection range including the inner margin of this inspection range is set, and the detection of the edge of the bump electrode is formed between the inner margin and the outer margin of the inspection range, thereby detecting the deformation of the bump electrode.
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