| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for reducing man-hours by marking several chips at a time in a step for marking chips as conforming or defective after inspecting a semiconductor wafer. SOLUTION: Several heating elements 1 are placed in the same arrangement with chips 5 on a semiconductor wafer 4. After inspecting the wafer, the heating elements 1 are made to generate heat according to the data of inspection and several chips are marked at a time. In this way, since the step of ink mark of the semiconductor wafer can be done by a batch processing, operations can be performed with less than half of the man-hours needed in the conventional way.
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