| 摘要 |
PROBLEM TO BE SOLVED: To effectively reduce the number of components regarding mechanism members which exist inside a case. SOLUTION: Waste substrates 21 which are arranged in an end portion of a printed board 7 and can be cut off are arranged inside a case 1 as reinforcing boards for bus bars 57, 58, 59. Consequently, the waste substrates 21 which become unnecessary after the printed board 7 is let flow into a solder dip tank are not abolished but used again as mechanism members inside the case 1. Hence, it is unnecessary that the mechanism members inside the case 1 are manufactured as independent components, and the number of the mechanism members can be reduced effectively.
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