METHOD FOR FORMING PATTERN OF CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a pattern of copper and a copper alloy capable of preventing a short circuit between wirings or a wiring thinning fault due to overetching from occurring in the formation of the fine pattern of forming the pattern of a circuit board. SOLUTION: The method for forming the pattern of the circuit board comprises the steps of forming the pattern by a plurality of etching liquids having different dissolving speeds of the copper and the copper alloy or an etching method.