| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip type inductor the manufacturing process of which can be simplified and the inductance of which can be set over a wide range, and then, which can be manufactured easily, can be packed in a bag, can be processed easily with a laser beam, and can be improved in yield, reliability, and Q-value. SOLUTION: This chip type inductor is provided with a coil member 14 having a coil 12 composed of a spiral conductor film and formed on the longitudinal peripheral surface of an insulating substrate 10, external electrodes 16 provided at both end sections of the member 14 so that the electrodes 16 may be connected to the end sections of the coil 12, and insulating films 18 which protect the outer periphery of the coil 12. The insulating substrate 10 has the same cubic cross-sectional shape over its full length and the thickness/width ratio of the chip in a cross section perpendicular to the axis of the coil is adjusted to <1. The external electrodes 16 are formed thicker in thickness than the insulating layer 18 on the broad surface of the coil member 14, and plated with a material 20 having high solder wettability including other conductor film exposing sections. For increasing the Q-factor, the coil 12 is formed almost over the full length of the substrate 10, and no conductor is provided on the end faces of the chip.
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