| 摘要 |
PROBLEM TO BE SOLVED: To provide a multichip module in which semiconductor chips can be connected to each other at high density and, at the same time, a power source can be reinforced. SOLUTION: This multichip module is provided with semiconductor chips 21-1 to 21-3, first substrates 24-1 to 24-3, a group of wires 27, and a second substrate 26. Each semiconductor chip has a group of two-dimensionally arranged first connecting terminals 22 and a group of second connecting terminals 23 which are arranged along one side of the chip. The semiconductor chips 21-1 to 21-3 are respectively mounted on the first substrates 24-1 to 24-3 interposed with the first connecting terminals 22. The groups of second connecting terminals 23 of the semiconductor chips 21-1 to 21-3 are electrically connected to each other so that signals are delivered and received among the groups 23. |
