发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To convey or store wafers in a manufacturing process under environment being most suitable for the treatment state of the wafers. SOLUTION: In the manufacturing method of semiconductor devices, the wafer is moved among pieces of manufacturing apparatus in a series of semiconductor manufacturing processes by accommodating the wafer into a wafer conveyance container having an environment control means. The method includes a step for carrying the wafer accommodated into the wafer conveyance container into the manufacturing apparatus, a step for changing the operation conditions of the environment control means to those corresponding to the wafer treatment/inspection of the manufacturing apparatus while specific treatment/inspection is being made, a step for accommodating the treated/ inspected wafer into the wafer conveyance container, and a step for conveying/ storing the wafer conveyance container to/at the manufacturing apparatus for composing the next manufacturing process, and for controlling the internal environment of the wafer conveyance container according to the changed operation conditions until the wafer is carried into the manufacturing apparatus.
申请公布号 JP2002313867(A) 申请公布日期 2002.10.25
申请号 JP20010060581 申请日期 2001.03.05
申请人 TOSHIBA CORP 发明人 NISHIKI KAZUHIRO
分类号 B65D85/86;B65G49/00;B65G49/07;H01L21/00;H01L21/673;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65D85/86
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