BASE WIRING BOARD AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To restrain an IC chip from being damaged in a transfer molding operation in a semiconductor device in which the IC chip is mounted on a base wiring board. SOLUTION: The semiconductor device is provided with the base wiring board 1 which comprises a wiring part, the IC chip 3 which is mounted on the board 1 and a molding resin part 4 which molds the IC chip 3. The board 1 comprises electrode pads 7, for external connection, which are connected to the wiring part and reinforcing pads 6 which restrain the board 1 from being deformed in the transfer molding operation.