发明名称 DEVICE AND METHOD FOR MOUNTING SURFACE-MOUNTED COMPONENT
摘要 PROBLEM TO BE SOLVED: To significantly improve manufacturing efficiency in manufacturing different type of electronic circuit boards with a device and method for mounting surface-mounted components. SOLUTION: The device for mounting the surface-mounted component comprises a mark recognition means for recognizing an existing mark arranged on the surface of a transferred substrate, an automatic search means for manufacturing program for automatically searching a manufacturing program corresponding to the existing mark, and an output means of mounting data for outputting the mounting data of a part of the manufacturing program automatically searched. The method for mounting the surface-mounted component comprises the steps of a mark recognition process, automatic search process of manufacturing program, and outputting process of the mounting data. Automatic searching for the appropriate manufacturing program corresponding to the existing mark and outputting only the mounting data of a part of the manufacturing program improves manufacturing efficiency.
申请公布号 JP2002314299(A) 申请公布日期 2002.10.25
申请号 JP20010110189 申请日期 2001.04.09
申请人 JUKI CORP 发明人 MIYAMOTO TETSURO
分类号 H05K13/04 主分类号 H05K13/04
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