BOARD HAVING BURIED THROUGH CONDUCTOR AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To manufacture a board having a through conductor buried with high density and high accuracy in a simple step at low cost with respect to the board having the buried through conductor and its manufacturing method. SOLUTION: A conductor 3 is inserted into a through hole with a diameter of 2 mm or less mode on a board 1. At the same time, a space between the through hole 2 and the conductor 3 is filled with an insulating resin 4.