| 摘要 |
PROBLEM TO BE SOLVED: To realize the highly accurate mounting of a chip, regardless of the variation of the position of the slot of an insulation tape. SOLUTION: By detecting a first position sensing pattern 34 and a second position sensing pattern 35, a segment center position P1 of each segment 31 of a mounting tape 30 is detected, and a recognition camera is positioned at the segment center position P1. Then, after determining a slot center position P2 where edges in the longitudinal and lateral directions of a slot 32 are halved respectively, a semiconductor chip 20 is overlapped to be mounted on the segment 31 so as to have a chip center position P3 of the semiconductor chip 20 coincides with the slot center position P2. Thereby, regardless of the variation in the position of the slot 32, the mounting of bonding pads 21 of the semiconductor chip 20 can be performed in a state where they are exposed surely from the slot 32 to the outside to enable sure laying of bonding wires in a later wire bonding process, etc. |
