| 摘要 |
PROBLEM TO BE SOLVED: To provide an interposer that prevents warpage even in reflow that is carried out after mounting to a packaging substrate, and can achieve a thin electronic circuit device, and to provide the electronic circuit device. SOLUTION: The electronic circuit device has a semiconductor chip 20 with a built-in electronic circuit. Also, the electronic circuit device has a substrate 10 that has a surface for mounting the semiconductor chip 20 and an outer edge section that projects to the outer-peripheral section on the mounting surface, a first connection terminal 11 that is formed on the mounting surface of the substrate 10 to connect to a terminal 21 of the semiconductor chip 20, the semiconductor chip 20 that has a terminal for connecting to the electronic circuit and is mounted onto the substrate 10 while the terminal 21 is connected to the first connection terminal 11, and resin 40 for reinforcement that is provided onto the substrate 10 inside the outer edge section. |
