| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of teaching operations performed to a device for mounting electronic components and enable the device for mounting electronic components to securely suck electronic components. SOLUTION: The device 1 for mounting electronic components sequentially sucks a plurality of electronic components arranged on a tray 13, a head 4 moves onto a board 4 and releases suction of the suction nozzle 12 to mounted the components 14, 14.... Teaching the suction position of the electronic components 14 to the device 1 for mounting electronic components, the device 1 for mounting electronic components sucks the electronic components 14 at the taught position and recognizes the shift quantity between the suction position of the electronic component 14 and a reference position. The device 1 for mounting electronic components calculates the suction position of the following electronic components 14 based on the pervious absorption position of the electronic components 14, shift quantity, and an input pitch. |
