| 摘要 |
PROBLEM TO BE SOLVED: To enable a flexible circuit board of a high quality to be manufactured by preventing the warpage of a film occurring due to a thermal contraction of a thermosetting solder resist 1 in manufacture of the flexible circuit board having a pattern 4 formed on the film 3 with a resin as a base. SOLUTION: A method for manufacturing the flexible circuit board comprises a step of mounting on the surface 2 of the solder resist 1 in a semi-cured state in which only the surface 2 of the resist 1 is cured. In the following step, since a step of heating such as mold heating or the like is provided after the mold heating, the resist is sufficiently cured to obtain necessary insulation. As another method, when curing the solder resist, the work is wound with the solder resist printing surface outside, and is heated and cured in the state of a coil. Further, as another method, the solder resist is printed on each of both front and rear surfaces or the like. Accordingly, the influence of the heating contraction of the resist 1 to the film 3 is reduced, and hence the warp of the film can be prevented.
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