PROBE CARD FOR FULL WAFER MEASUREMENT AND INSPECTION AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a probe card by which a full wafer can be measured and inspected by using high-frequency signals. SOLUTION: The probe card for batch measurement and inspection of wafers is provided with several bump electrodes 22b which are two-dimensionally arranged and a multilayer wiring board 21 which is electrically connected to the several bump electrodes 22b. The multilayer wiring board 21 has a ceramic multilayer substrate 21a and a thin-film wiring layer 21b which is formed by a lithography technique.