| 摘要 |
PROBLEM TO BE SOLVED: To achieve a semiconductor package that can be miniaturized by increasing the number of leads without increasing the dimensions of the semiconductor package, and to provide a method for manufacturing the reliable semiconductor package. SOLUTION: An inner-periphery lead 4 is provided around a stage 3 for supporting a semiconductor chip 2. The inner-peripheral lead 4 allows the peripheral section of the stage 3 to function as a lead by mutually short-circuiting pins each having the same potential such as a ground pin via the stage 3. To prevent the generation of resin burrs on the lower surface of the inner-periphery lead 4, sealing is made by a means of setting the position of the inner-periphery lead lower than that of an outer-periphery one for clamping by a mold die, or by a means of putting a sealing tape onto the lower surface of the inner- periphery lead.
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