发明名称 |
METHOD OF FORMING FINE PATTERN, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To etch substrates having different open area ratios while suppressing fluctuations in processing shape to form a fine pattern. SOLUTION: The method for forming a fine pattern includes steps of forming an interlayer insulating film in a substrate and forming a plurality of holes in the interlayer insulating film by etching. The open area ratio of the fine pattern is adjusted by involving a dummy hole in the holes.
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申请公布号 |
JP2002313908(A) |
申请公布日期 |
2002.10.25 |
申请号 |
JP20010113902 |
申请日期 |
2001.04.12 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
MORI KIYOSHI |
分类号 |
H01L21/3205;H01L21/768;H01L21/82;H01L21/8242;H01L23/52;(IPC1-7):H01L21/768;H01L21/320 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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