| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable PGA-type semiconductor device without strain in a semiconductor element due to thermal stress. SOLUTION: A plurality of pins 3 each having a rectangular section which is to be arranged on the pin arrangement surface of a substrate 2 where the semiconductor element 1 is packaged, so that the long side of the rectangular pin 2 is arranged along the circumference of a circle where the center of the substrate 2 is used as a center.
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