SEAMLESS PIPE FOR FIXING DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent a conductive layer from peeling from the outer peripheral surface of a tubular body of a heat resistant resin film even if a copper layer is disposed as the conductive layer. SOLUTION: This seamless pipe for a fixing device consists of the tubular body 2 of the heat resistant resin film and a metallic layer 3 exclusive of copper, copper layer 4 and surface release layer 5 successively formed on the outer peripheral surface of this tubular body 2 of the heat resistant resin film. The metal described above is formed by an ion beam-assisted vapor deposition method.