发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To form a gate bird's beak without increasing wiring resistance of a gate wire and embed an inter-layer insulation film between gate wirings readily. SOLUTION: A gate oxide film 2 is formed on a substrate 1, and a gate wire comprising a first silicon film 3, a silicide film 4 and an insulation film 5 is formed on the gate oxide film 2. Then, impurities are implanted by using the gate wire as a mask and a first diffusion layer 6 is formed. A second silicon film is formed all over the substrate 1 to cover the gate wire. The second silicon film is subjected to thermal oxidation and a thermal oxide film 8 is formed. A layer insulation film 9 is formed on the thermal oxide film 8.
申请公布号 JP2002314068(A) 申请公布日期 2002.10.25
申请号 JP20010116398 申请日期 2001.04.16
申请人 MITSUBISHI ELECTRIC CORP 发明人 TERAUCHI TAKASHI;TERAMOTO AKINOBU
分类号 H01L29/78;H01L21/768;H01L21/8242;H01L21/8247;H01L27/108;H01L27/115 主分类号 H01L29/78
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