| 摘要 |
PROBLEM TO BE SOLVED: To provide a power semiconductor module provided with a terminal connecting section in which external wires can be connected electrically to outside connecting electrodes with high reliability. SOLUTION: This power semiconductor module is provided with a semiconductor element, the outside connecting terminals electrically connected to the external wires, and a screw mechanism for securing the contact pressures of the conductor contacting surfaces of the external wire and outside connecting terminals. This module is also provided with a heat sink which radiates the heat generated from the semiconductor element to an external heat radiating mechanism. In this module, the angles between the conductor contacting surfaces of the external wires and outside connecting terminals and the propelling direction of the screw mechanism are adjusted to be in the range of 0 deg.-45 deg.. |
