LAMINATE FOR ELECTROPHOTOGRAPHIC PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a laminate for an electrophotographic method printed circuit without bringing about a conduction fault of a through hole or a non- through hole of a high aspect ratio, even by a double-side simultaneous toner developing method without developing step of hole filling or sequentially developing one side surfaces, in an electrophotographic printed circuit board having the through hole or the non-through hole. SOLUTION: The laminate for the electrophotographic method printed circuit is obtained by coating an electrophotographic coating liquid on a conductive base 1 having the through hole 4 or/and the non-through hole 5 and providing a photosensitive layer. The laminate for the printed board having the through hole or/and the non-through hole in which no bubble exists is obtained, is provided by fully filling a solvent at last in the through hole or/and the non-through hole, then coating the electrophotographic coating liquid and forming the photosensitive layer.