发明名称 FLEXIBLE PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a flexible printed wiring board with low manufacturing cost and low disposal cost of defects without a mismatch of a pitch in minute pitch pattern even during a solder flow step used for mounting a passive component. SOLUTION: An active component mounting flexible printed wiring board 10 having a minute pitch pattern, and an active component 11 like IC mounted thereon and a passive component mounting flexible printed wiring board 20 having a passive component 21 mounted as a peripheral circuit, are bonded with an anisotropically conductive adhesive 22. At the same time, connecting terminals 12 and 23 corresponding these flexible printed wiring boards 10 and 20 are connected electrically with each other.
申请公布号 JP2002314216(A) 申请公布日期 2002.10.25
申请号 JP20010110940 申请日期 2001.04.10
申请人 SHIN ETSU POLYMER CO LTD 发明人 SUDA TAKUMI
分类号 H05K1/03;H05K1/14;(IPC1-7):H05K1/14 主分类号 H05K1/03
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