PACKAGE FOR OPTICAL COMMUNICATION

摘要

PROBLEM TO BE SOLVED: To provide a package for optical communication having airtight reliability without increasing the size of the package. SOLUTION: In the package 10 for optical communication where a through hole 20 for communicating with a cavity section 14 is formed at one sidewall section of a substrate 15 for forming the cavity section 14 to mount a semiconductor device for optical communication to the inside and a translucent member 28 opposing the tip of an optical fiber 27 is provided in an insertion hole 22 of a metal fixing member 21 that is inserted into the through hole 20 for sticking, a step section 25 and a channel 26 are provided. At the step section 25, the through hole 22 of the metal fixing member 21 becomes a small-diameter hole 24 from a large-diameter hole 23 being smaller than the diameter of the through hole 20. The channel 26 is provided in the direction of the insertion hole 22 along the large-diameter hole 23 of the step section 25. A translucent member 28 is joined to the step section 25 by low-melt-point glass 29.