发明名称 METHOD AND APPARATUS FOR MOUNTING COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method and apparatus for mounting components wherein the manufacturing efficiency can be improved and the damage to the work can be also reduced by improving the processing procedures in the mounting process. SOLUTION: In the method for mounting components, a liquid-crystal panel 10A is mounted on a carrying pallet 120 moving on a carrying passage 110. The carrying pallet 120 is stopped for its positioning by a stopping means 159. Then, a flexible wiring circuit board 10B is transported on the carrying pallet 120 by a transporting means 155 of a temporarily mounting mechanism 150, and is positioned. Thereafter, the flexible wiring circuit board 10B is mounted temporarily on the liquid-crystal panel 10A by a temporarily mounting head 158.
申请公布号 JP2002313818(A) 申请公布日期 2002.10.25
申请号 JP20010112596 申请日期 2001.04.11
申请人 SEIKO EPSON CORP 发明人 MARUYAMA TAKAYUKI
分类号 G02F1/13;G02F1/1345;H01L21/50;(IPC1-7):H01L21/50;G02F1/134 主分类号 G02F1/13
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