| 摘要 |
PROBLEM TO BE SOLVED: To achieve a plasma treatment apparatus that can be applied to various processes, and requires less installation area. SOLUTION: In the plasma treatment apparatus, a substrate transfer mechanism 4 for transferring a substrate between chambers is provided in a main vacuum chamber 3 where a vacuum chamber 2 for plasma treatment or the like is interlocked in a radial or fan shape from the side. In this case, the substrate transfer mechanism 4 sets the substrate to a vertical position for transferring. A cylindrical pad 6 is rotatably established, and a plate-shaped notching 6a that allows the substrate to be accommodated or to pass is formed in the cylindrical pad 6. Additionally, a hollow section 6c is formed. |
