| 摘要 |
The intermediate carrier has a flat carrier body (10) with its upper surface provided with inner terminals (22) for contacting terminal elements (21) of a semiconductor component (2) and its lower surface provided with outer terminals (18) for contacting a circuit board, conductive connections between the opposite surfaces provided via metallized throughbores. The walls of the throughbores are partially exposed by adjacent recesses (14,16) in the lower surface of the carrier body, for providing freely projecting studs (15,17) acting as the outer terminals. Also included are Independent claims for the following: (a) a semiconductor module with an intermediate carrier; (b) a manufacturing method for an intermediate carrier for a semiconductor module |
