VERFAHREN ZUR HERSTELLUNG VON GEDRUCKTEN LEITERPLATTEN UND SO HERGESTELLTE GEDRUCKTE LEITERPLATTEN

摘要

There is described a process for producing printed circuits comprising a laminar support, an electrically conductive track on the laminar support, and an auxiliary conductive element soldered to the conductive track. There is a provision to apply the auxiliary conductive element by means of an apparatus for applying SMD components.