发明名称 RADIATION TYPE BGA PACKAGE AND PRODUCTION METHOD THEREFOR
摘要 <p>(1) A radiation type BGA package formed by joining a metal radiation sheet to one surface of a plastic circuit board having a notched space at the center thereof, the package being provided with a tightening member for joining the plastic circuit board and the radiation sheet together. A tightening member may includes a caulking member, a rivet, a screw, an eyelet or a tubular rivet. Especially, a dam-use member to be fixed by a tightening member is preferably provided. (2) A radiation type BGA package comprising a circuit pattern provided inside a plastic circuit board, a radiation sheet and/or a dam-use member being electrically connected with part of this circuit pattern via a tightening member. A tightening member covered with solder is preferably used.</p>
申请公布号 WO2002084733(P1) 申请公布日期 2002.10.24
申请号 JP2002003530 申请日期 2002.04.08
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