发明名称 Packaging bag for semiconductor wafer and method of packaging semiconductor wafer using the packaging bag
摘要 There is provided a packaging bag 1 for semiconductor wafer for packaging a shipping container having semiconductor wafers stored therein, wherein the packaging bag is provided with a handle 4. The handle is preferably formed of a welded part 2 and hole 3 opened in the welded part, particularly, a plurality of holes having circular or elliptical shape are preferably provided in the welded part. Whereby there is provided a packaging bag which enables even a heavy shipping container having wafers of large diameter stored therein to be easily taken in and out of an external box, and enables a workability to improve.
申请公布号 US2002153526(A1) 申请公布日期 2002.10.24
申请号 US20020111658 申请日期 2002.04.25
申请人 TOYAMA KOHEI;SHIMIZU TSUBASA 发明人 TOYAMA KOHEI;SHIMIZU TSUBASA
分类号 B65D33/08;B65D75/12;B65D77/04;B65D81/02;B65D85/86;H01L21/673;(IPC1-7):H01L23/58 主分类号 B65D33/08
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